# HS Code for wafer bumping devices

Source: https://www.findhs.codes/hs-code-for-wafer-bumping-devices

> The 6-digit HS code for wafer bumping devices is 8486.40. The first 6 digits are the same in every country using the Harmonized System; the full 8-10 digit national code (e.g. EU TARIC, US HTSUS) depends on the destination country.

## HS codes (6-digit)

| HS Code (6-digit) | Description | Sample product |
|---|---|---|
| 8486.40 |  | Handling robot (see appendix for illustration) - consisting of a vertical column or a mounting base with a robot articulated arm, wafer holder, DC drive system and supply connections, - for automatically controllable mechanical position alignment of 150/200/300mm semiconductor wafers (wafers) and... |

Full national tariff codes (8-10 digits, e.g. EU TARIC, US HTSUS, UK, China, Japan, India, Turkey) and applicable customs duty rates are available on https://www.findhs.codes/hs-code-for-wafer-bumping-devices for registered users.

## Notes

Wafer bumping which is a process where connections are formed on an entire wafer before dicing

## See also

- [HS Code for machines and apparatus specified in note 11C to this chapter](https://www.findhs.codes/hs-code-for-machines-and-apparatus-specified-in-note-11C-to-this-chapter)