# HS-Code für Wafer-Bumping-Vorrichtungen

Source: https://www.findhs.codes/hs-code-fur-wafer-bumping-vorrichtungen

> Der 6-stellige HS-Code für Wafer-Bumping-Vorrichtungen ist 8486.40. Die ersten 6 Stellen sind in allen Ländern des Harmonisierten Systems gleich; der vollständige 8- bis 10-stellige Code (z. B. EU TARIC, US HTSUS) hängt vom Bestimmungsland ab.

## HS codes (6-digit)

| HS Code (6-digit) | Description | Sample product |
|---|---|---|
| 8486.40 |  | Handling robot (see appendix for illustration) - consisting of a vertical column or a mounting base with a robot articulated arm, wafer holder, DC drive system and supply connections, - for automatically controllable mechanical position alignment of 150/200/300mm semiconductor wafers (wafers) and... |

Full national tariff codes (8-10 digits, e.g. EU TARIC, US HTSUS, UK, China, Japan, India, Turkey) and applicable customs duty rates are available on https://www.findhs.codes/hs-code-fur-wafer-bumping-vorrichtungen for registered users.

## Notes

Wafer bumping which is a process where connections are formed on an entire wafer before dicing