US Customs Ruling (CROSS)
HS Code : | 8542.90 | |
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HTS Code : | 8542.90.•••• | |
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Ruling Number :
Issuing Country :
UNITED STATES
Date Of Issue : 2004-07-01T00:00:00
Aluminum Nitride Plain Substrate, Aluminum Nitride Copper Coated Substrate, Silicon Nitride Plain Substrate, and Silicon Nitride Copper Coated Substrate are high thermal conductivity substrates designed for mounting high power semiconductor components and circuits, enabling safe, reliable, and efficient operation by dissipating heat generated by radio and microwave frequency devices.
Description : Aluminum Nitride Plain Substrate, Aluminum Nitride Copper Coated Substrate, Silicon Nitride Plain Substrate, and Silicon Nitride Copper Coated Substrate
Please importantly note that only the relevant portion of the related US Ruling (Cross) is displayed above. You may refer to the said customs ruling for the entire ruling explanation.
Source : US Customs Ruling (CROSS)
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