HS Code for wafer bumping devices


Product
wafer bumping devices
HS Code (6-digit)
8486.40.••.••
See full HS code

The 6-digit HS code for wafer bumping devices is 8486.40.

The first 6 digits are the same in every country using the Harmonized System; the full 8-10 digit national code (e.g. EU TARIC, US HTSUS) depends on the destination country.

Wafer bumping which is a process where connections are formed on an entire wafer before dicing

Sample products for "wafer bumping devices"

EU Binding Tariff Information

Dünya Gümrük ÖrgütüHS Code : 8486.40
CN Code : 8486.40.••.••

BTI Reference :

Issuing Country : GERMANY

Date Of Issue : 08.Sep.2025 - 07.Sep.2028

Automated handling robot for precise mechanical alignment of 150/200/300mm semiconductor wafers and photomasks in three axes, featuring a vertical column or mounting base, robotic jointed arm, wafer holder, DC drive system, and power connections, available in multiple variants with differing technical specifications and configurations.

Description auto translated : Handling robot (see appendix for illustration) - consisting of a vertical column or a mounting base with a robot articulated arm, wafer holder, DC drive system and supply connections, - for automatically controllable mechanical position alignment of 150/200/300mm semiconductor wafers (wafers) and photomasks in three movement axes, - available in several model variants with different technical parameters and different Equipment."Device used exclusively for lifting, conveying, loading and unloading   semiconductor wafers, referred to in Note 11 C) to Chapter 84 -   Handling robots"

Original Description: Handhabungsroboter (Abbildung siehe Anlage)- aus einer Vertikalsäule bzw. einem Montagesockel mit Roboter-Gelenkarm, Wafer-Aufnahme,  Gleichstrom-Antriebssystem und Versorgungsanschlüssen,- zum automatisch nach Programm steuerbaren mechanischen Lage-Ausrichten von   150/200/300mm-Halbleiterscheiben (wafers) und Fotomasken in drei Bewegungsachsen,- erhältlich in mehreren Modellvarianten mit verschiedenen technischen Parametern und  unterschiedlicher Ausstattung."Gerät ausschließlich verwendet zum Heben, Fördern, Laden und Entladen von   Halbleiterscheiben (wafers), in Anmerkung 11 C) zu Kapitel 84 genannt -   Handhabungsroboter"

Source : EU Binding Tariff Information
source link :

See also

By clicking "Find Related HS Code" button above, you can find 6 digits universal HS Code (which is valid for almost all countries in the world) and declarable codes for EU, UK, USA, Japan, China, India and Turkey (e.g. 10 digits TARIC code for EU countries or HTSUS code for USA) of "wafer bumping devices".

You can also find customs duty rates applicable for importing of "wafer bumping devices" into the USA and the European Union Countries.



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