HTS Code for infrared focal plane arrays


Product
infrared focal plane arrays

Sample products for "infrared focal plane arrays"

EU Binding Tariff Information

Dünya Gümrük ÖrgütüHS Code :
CN Code :

BTI Reference :

Issuing Country : GERMANY

Date Of Issue : 19.Jul.2011 - 18.Jul.2017

Infrared Focal Plane Array (FPA) consisting of a 126 mm housing with a diameter of 102 mm and weighing 2.2 kg, containing optics, a detector, and a cooling module. It is part of a rocket warning system installed in an aircraft, detecting temperature radiation around the plane and its surroundings.

Description auto translated : Infrared sensor, known as Infrared Focal Plane Array (FPA), essentially consisting of a 126 mm diameter case with a diameter of 102 mm and a weight of 2.2 kg, in which an optical system, a detector and a cooling imagers are. The IR sensors are part of a missile warning system which is installed in an aircraft. Take the temperature of radiation on the aircraft and the associated solid angle. The complete measurement data (not part of the BTI) forwarded to analysis box and processed. The product is called "optical apparatus for measuring or checking in Chapter 90 not elsewhere specified or included, not for testing semiconductor wafers (discs) or semiconductor devices or for inspecting photomasks or reticles used in manufacturing semiconductor devices, a profile projector" was used....

Original Description: Infrarot Sensor, so genannter Infrared Focal Plane Array (FPA), im Wesentlichen bestehend aus einem 126 mm großen Gehäuse mit einem Durchmesser von 102 mm und einem Gewicht von 2,2 Kg, in dem sich eine Optik, einem Detektor und einem Kühlimager befinden. Die IR-Sensoren gehören zu einem Raketenwarnsystem welches in einem Flugzeug eingebaut wird. Sie nehmen die Temperaturstrahlung um das Flugzeug und die dazugehörigen Raumwinkel auf. Die kompletten Messdaten werden an eine Auswertebox (nicht Bestandteil der VZTA) weitergeleitet und -verarbeitet. Die Ware wird als "optisches Gerät zum Messen oder Prüfen, in Kap. 90 anderweit weder genannt noch inbegriffen, nicht zum Prüfen von Halbleiterscheiben (wafers) oder Halbleiterbauelementen oder zum Prüfen von Fotomasken und Reticles für die Herstellung von Halbleiterbauelementen, kein Profilprojektor" eingereiht.

Source : EU Binding Tariff Information
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