US Customs Ruling (CROSS)
HS Code : | 3405.90 | |
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HTS Code : | 3405.90.•••• | |
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Ruling Number :
Issuing Country :
UNITED STATES
Date Of Issue : 2025-06-02T00:00:00
Chemical Mechanical Planarization (CMP) Slurries are specialized liquid mixtures of abrasive particles, chemicals and purified water used in silicon wafer production to polish semiconductor wafers to a flat, smooth surface and level the surface between different layers of materials to ensure proper electrical connections of semiconductor chips
Description : Chemical Mechanical Planarization (CMP) Slurries
Please importantly note that only the relevant portion of the related US Ruling (Cross) is displayed above. You may refer to the said customs ruling for the entire ruling explanation.
Source : US Customs Ruling (CROSS)
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